DocumentCode :
2050972
Title :
Electric conduction improvement of well-structured multi-walled carbon nanotubes
Author :
Tsai, J.T.H. ; Chiao, Y.T. ; Zhang, Y. ; Milne, W.I.
Author_Institution :
Grad. Inst. of Electro-Opt. Eng., Tatung Univ., Taipei, Taiwan
fYear :
2010
fDate :
21-24 Nov. 2010
Firstpage :
963
Lastpage :
965
Abstract :
We characterized the electrical conductance of well-structured multi-walled carbon nanotubes (MWCNTs) which had post-treated by a rapid vacuum arc thermal annealing process and structure defects in these nanotubes are removed. We found that the after rapid vacuum arc annealing, the conductivity of well-structured MWCNTs can be improved by an order of magnitude. We also investigated the conductivity of MWCNTs bundle by the variation of temperatures. These results show that the conductance of annealed defect-free MWCNTs is sensitive to temperature imply the phonon scatting dominated the electron conductions. Compare to the well-structured MWCNTs, the defect scattering dominated the electron conduction in the as-grown control sample which has large amount of structure defects. A detail measurement of electron conduction from an individual well-structured MWCNT shows that the conductivity increases with temperatures which imply such MWCNTs exhibited semiconductor properties. We also produced back-gated field-effect transistors using these MWCNTs. It shows that the well-structured MWCNT can act as p-type semiconductor.
Keywords :
carbon nanotubes; crystal defects; electrical conductivity; field effect transistors; phonons; rapid thermal annealing; vacuum arcs; C; back-gated field-effect transistors; defect scattering; electrical conductivity; electron conductions; multiwalled carbon nanotubes; p-type semiconductor; phonon scatting; rapid vacuum arc thermal annealing; semiconductor properties; structure defects; well-structured MWCNT; microanalysis; rapid solidification; recrystallization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2010 - 2010 IEEE Region 10 Conference
Conference_Location :
Fukuoka
ISSN :
pending
Print_ISBN :
978-1-4244-6889-8
Type :
conf
DOI :
10.1109/TENCON.2010.5686539
Filename :
5686539
Link To Document :
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