DocumentCode :
2051351
Title :
Measurement and analysis of anti-resonance peak in total PDN impedance
Author :
Kiyoshige, Sho ; Ichimura, Wataru ; Terasaki, Masahiro ; Kobayashi, Ryota ; Kubo, Genki ; Otsuka, Hiroyuki ; Sudo, Toshio
Author_Institution :
Shibaura Inst. of Technol., Tokyo, Japan
fYear :
2013
fDate :
2-6 Sept. 2013
Firstpage :
931
Lastpage :
936
Abstract :
Power integrity is a serious issue in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, effects of critical damping condition for the total PDN impedance on power supply noise has been studied by adding different RC circuit to the intrinsic on-die RC circuit of chip. Three test chips were assumed to be designed with different on-chip PDN properties. The measurement and analysis of power supply noises for the three test chips showed typical characteristics of oscillatory region and damped regions The critical damping condition against the anti-resonance peak has been proved to be effective to suppress the power supply noise on the chip.
Keywords :
CMOS digital integrated circuits; RC circuits; circuit stability; electric impedance; electromagnetic interference; integrated circuit noise; integrated circuit packaging; integrated circuit testing; power integrated circuits; power supply circuits; CMOS digital systems; EMI; antiresonance peak analysis; antiresonance peak measurement; chip-package codesign; chip-package interaction; core circuits; critical damping condition; damped regions; electromagnetic interference; electromagnetic radiation; logic instability; on-chip PDN properties; on-die RC circuit; oscillatory region; parallel resonance peaks; power distribution network; power integrity; power supply fluctuation; power supply noise; signal integrity degradation; test chips; total PDN impedance; Capacitance; Integrated circuit modeling; Noise; Power supplies; Semiconductor device measurement; Solid modeling; System-on-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC EUROPE), 2013 International Symposium on
Conference_Location :
Brugge
ISSN :
2325-0356
Type :
conf
Filename :
6653435
Link To Document :
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