• DocumentCode
    2051439
  • Title

    Physical mechanism and temperature acceleration of relaxation effects in phase-change memory cells

  • Author

    Ielmini, D. ; Sharma, D. ; Lavizzari, S. ; Lacaita, A.L.

  • Author_Institution
    Dipt. di Elettron. ed Inf., Politec. di Milano, Milan
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    597
  • Lastpage
    603
  • Abstract
    The main reliability issues of phase change memory (PCM) cells are related to the metastable nature of the amorphous phase in the chalcogenide material. The amorphous phase spontaneously evolves during time by crystallization and structural relaxation, that is the short range ordering in the amorphous phase to minimize the defect concentration and free energy. Crystallization physics has been studied by almost 60 years, and application of the standard nucleation theory has been successfully applied to provide extrapolation methodologies for PCM reliability estimation. On the other hand, structural relaxation and its impact on carrier transport in the amorphous chalcogenide are not completely understood yet. The purpose of this paper is to study structural relaxation effects in PCM cells, focusing on a) the physical interpretation of the relaxation and b) the temperature acceleration of the phenomenon, which is essential to provide extrapolation techniques and analytical compact models for prediction of PCM reliability.
  • Keywords
    crystal growth; extrapolation; phase change materials; random-access storage; amorphous phase; analytical compact model; chalcogenide material; data retention; extrapolation techniques; phase-change memory cells; physical mechanism; structural relaxation effects; temperature acceleration; Acceleration; Amorphous materials; Crystalline materials; Crystallization; Extrapolation; Materials reliability; Metastasis; Phase change materials; Phase change memory; Temperature; Phase change memory; chalcogenide; data retention;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558952
  • Filename
    4558952