• DocumentCode
    2051523
  • Title

    Statistical Modeling of Leakage Currents Through SiO2/High-κ Dielectrics Stacks for Non-Volatile Memory Applications

  • Author

    Padovani, Andrea ; Larcher, Luca ; Verma, Sarves ; Pavan, Paolo ; Majhi, Prashant ; Kapur, Pawan ; Parat, Krishna ; Bersuker, Gennadi ; Saraswat, Krishna

  • Author_Institution
    Dipt. di Ing., Univ. di Ferrara, Ferrara
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    616
  • Lastpage
    620
  • Abstract
    We present here a statistical Monte Carlo (MC) simulator modeling leakage currents across SiO2/high-kappa dielectric stacks. We show that simulations accurately reproduce experimental currents measured at various temperatures on capacitors with different high-k dielectric stacks. We exploit statistical simulations to investigate the impact of high-kappapsilas traps on leakage current distribution for flash memory applications. We demonstrate that the high defectiveness typical of high-k materials strongly reduces the potential improvement due to the introduction of band-gap engineered high-kappa tunnel dielectric stacks. In this regard, the simulator is a useful tool to optimize high-kappa tunnel stacks and to improve technology reliability issues related to flash memory applications.
  • Keywords
    Monte Carlo methods; flash memories; leakage currents; semiconductor materials; silicon compounds; statistical analysis; SiO2; flash memory applications; high-kappa dielectrics stacks; leakage current distribution; leakage currents; nonvolatile memory applications; statistical Monte Carlo simulator; statistical modeling; Capacitors; Current measurement; Dielectric measurements; Flash memory; High K dielectric materials; High-K gate dielectrics; Leakage current; Monte Carlo methods; Photonic band gap; Temperature measurement; Flash memories; dielectrics; high-κ; leakage current modeling; modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558955
  • Filename
    4558955