DocumentCode :
2051757
Title :
Multi-channel, high-density, ultra-low capacitance arrays for ESD and surge protection
Author :
Marreiro, David ; Shastri, Sudhama ; Liu, Mingjiao ; Keena, Thomas ; Khan, Shamsul ; Salih, Ali ; Etter, Steve ; Grivna, Gordy ; Parsey, John ; Ashton, Robert ; Loo, Suem ; Jones, Rob ; Robinson, Lon ; Buhrman, Bob ; Hurley, Ryan
Author_Institution :
ON Semicond., Phoenix, AZ
fYear :
2008
fDate :
April 27 2008-May 1 2008
Firstpage :
637
Lastpage :
638
Abstract :
A novel protection device providing ultra-low line capacitance and improved ESD (J. E. Vinson et al., 2003) and surge capability is presented. Applications include stand-alone protection arrays and integrated protection in baseband- or RF-filters. A proprietary epitaxial layer and isolation capability enable high levels of surge power handling capability, while keeping line capacitance low and reducing device footprint. The response of the device to ESD and surge stresses is investigated at wafer- and package-level. Process condition variations and derived structures are studied, along with a consideration of issues related to the measurement of capacitance, ESD and surge capability.
Keywords :
Zener diodes; arrays; electrostatic discharge; epitaxial layers; radiofrequency filters; surge protection; wafer level packaging; ESD; RF filters; baseband filters; integrated protection; isolation capability; multichannel high-density ultralow capacitance arrays; package-level process; proprietary epitaxial layer; protection device; surge power handling capability; surge protection; surge stresses; wafer level process; Capacitance measurement; Costs; Electrostatic discharge; Packaging; Parasitic capacitance; Semiconductor diodes; Stress; Surge protection; Surges; Wafer scale integration; ESD; Low-capacitance; Zener diode; protection array; surge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
Type :
conf
DOI :
10.1109/RELPHY.2008.4558964
Filename :
4558964
Link To Document :
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