Nano-Roughening for Reliable N/MEMS Manufacture

Author

Yang, Chia-Yeh ; Cheng, Y.T. ; Hsu, W.S.

Author_Institution

Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu

fYear

2006

fDate

18-21 Jan. 2006

Firstpage

153

Lastpage

156

Abstract

This paper presents a nano-roughening technique to effectively modify bonding surface for ensuring for the continuation of hermetic encapsulation shrinkage from MEMS to NEMS. The roughening is realized via a non-uniform etch characteristic of PR which is etched then utilized as an etching mask for the following silicon etching process. UV adhesive bonding is utilized for the verification of the nano-roughening for NEMS hermetic encapsulation. The average roughnesses of silicon substrate before and after the modification are 0.4nm and 12.4nm respectively. The roughness increase can effectively provide more than 30% bonding strength enhancement and 8% leakage reduction

Keywords

encapsulation; laser beam etching; micromechanical devices; nanoelectronics; silicon; surface roughness; N/MEMS manufacture; NEMS; Si; UV adhesive bonding; bonding strength; bonding surface; etching mask; hermetic encapsulation shrinkage; leakage reduction; nanoroughening; nonuniform etch; silicon etching; silicon substrate; Bonding; Costs; Encapsulation; Etching; Manufacturing; Micromechanical devices; Nanoelectromechanical systems; Rough surfaces; Silicon; Surface roughness; Bonding; Hermetic Encapsulation; NEMS Manufacture; Nano-roughening; UV Adhesive;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on

Conference_Location

Zhuhai

Print_ISBN

1-4244-0139-9

Electronic_ISBN

1-4244-0140-2

Type

conf

DOI

10.1109/NEMS.2006.334659

Filename

4134924