• DocumentCode
    2053139
  • Title

    Dielectric properties of filled carbon nanotubes/epoxy composites with high dielectric constant

  • Author

    Guo, Xiusheng ; Yu, Demei ; Gao, Yan ; Li, Qin ; Wan, Weitao ; Gao, Zhan

  • Author_Institution
    State Key Lab of the Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ.
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    295
  • Lastpage
    298
  • Abstract
    In this paper, the multiwall carbon nanotubes were opened and then filled with Cu and Ag materials. Several kinds of carbon nanotubes/epoxy composites were prepared by melt mixing epoxy resin and the nanotubers mentioned above. The dielectric properties of the composites were investigated at room temperature. Experimental results showed that the dielectric properties of the MWNTs/epoxy composites depended evidently on the characteristics of the nanotubes and their content in the composites. A dielectric constant of 305 of the composite with 1.1 Wt% Ag-filled nanotubes was observed in the low frequency range, which is 80 times higher than that of the epoxy matrix. The filler loading level in the composites required to reach high dielectric constant is much lower than that of ceramic composites, which enable the MWNTs composites to posses good mechanical properties
  • Keywords
    carbon nanotubes; ceramics; composite materials; copper; permittivity; polymers; silver; Ag-filled nanotube; C-Ag; C-Cu; Cu-filled nanotube; MWNT composite; ceramic composite; dielectric constant; filled carbon nanotubes-epoxy composite; filler loading level; mechanical properties; melt mixing epoxy resin; multiwall carbon nanotubes; nanotubers; Carbon nanotubes; Ceramics; Dielectric constant; Dielectric materials; Epoxy resins; Frequency; High-K gate dielectrics; Mechanical factors; Organic materials; Temperature; Carbon nanotube; Composites; Dielectric property; Epoxy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334726
  • Filename
    4134956