DocumentCode
2053235
Title
A Low Noise Bulk Micromachined Gyroscope with Symmetrical and Decoupled Structure
Author
Chen, Hong ; Liu, Xiaowei ; Huo, Mingxue ; Chen, Weiping
Author_Institution
MEMS Center, Harbin Inst. of Technol.
fYear
2006
fDate
18-21 Jan. 2006
Firstpage
306
Lastpage
309
Abstract
This paper presents a low noise bulk micromachined gyroscope. The design of frame and independent beams reduces the mechanical coupling between the drive mode and sense mode, and facilitate the frequency match of two modes. The gyroscope with a 100-120-mum-structure thickness and an aspect ratio about 12 is fabricated by DRIE technology and silicon-glass anodic bonding, which provides a high sense capacitance about 2.1 pF and a weighty proof mass about 1.27 mg. Resonant frequencies of the drive and sense mode are measured to be 1610 and 1676 Hz, respectively. The gyroscope can achieve a 2.97 muN electrostatic driving force by applying of a 6V AC and 15V DC bias voltage on the driving electrodes. The thermal-mechanical noise floor is estimated to be about 0.12deg/h/Hzfrac12 at atmospheric pressure
Keywords
adhesive bonding; gyroscopes; micromachining; micromechanical devices; 100 to 120 micron; 15 V; 2.1 pF; 6 V; DRIE technology; MEMS design; aspect ratio; capacitance; drive mode; electrostatic driving force; low noise bulk micromachined gyroscope; mechanical coupling; sense mode; silicon-glass anodic bonding; thermal-mechanical noise floor; weighty proof mass; Bonding; Circuits; Electrostatics; Gyroscopes; Micromechanical devices; Parasitic capacitance; Residual stresses; Semiconductor device noise; Silicon; Substrates; DRIE; MEMS; anodic bonding; gyroscope;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location
Zhuhai
Print_ISBN
1-4244-0139-9
Electronic_ISBN
1-4244-0140-2
Type
conf
DOI
10.1109/NEMS.2006.334729
Filename
4134959
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