Improvement of the defect level of microcomputer LSI testing

The most important points concerning the manufacturing test of VLSI are (1) High quality testing, (2) Low cost testing procedures and (3) Fast development. However, together with the high integration of VLSI, recent large-scale, multi-functional and complex technology has made the above test procedures more and more difficult to secure. Especially in regard to measurement quality, where stable measurement is performed at the factory, and the testing results quality, which prevents faulty devices from being shipped once test is completed, the actual level of technology does not provide a complete solution for the initial stage of the introduction at the factory even through the implementation of a large number of procedures. This paper will study the reduction in the defect level in order to improve the quality of microprocessors through the addition of new methods (“flag check” and “address check”) to the conventional Single Stuck-at Fault verification