DocumentCode :
2054060
Title :
Study of Evaporation Phenomena in Micro Channels
Author :
Chou, Yen-Chih ; Chen, Yu-Tang ; Kang, Shung-Wen
Author_Institution :
Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Taipei
fYear :
2006
fDate :
18-21 Jan. 2006
Firstpage :
446
Lastpage :
449
Abstract :
Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions in micro channels chip structure, as well as the induced evaporation mass flow rate of water, were measured under different heat flux and inclination angle. Thermal resistances were calculated to evaluate the chip cooling performance. The experimental results show that with an increase of the imposed heat flux, the evaporation mass flow rate increases and thermal resistance decreases. The effect of channel sizes and inclination angle on the heat transfer characteristics are also examined
Keywords :
capillarity; evaporation; micromachining; micromechanical devices; silicon; thermal resistance; water; 75 mm; Si; bulk micromachining; capillary driven heat; chip cooling performance; electronic cooling; evaporation mass flow rate; heat flux; heat transfer characteristics; inclination angle; micro channels chip structure; two-phase convective flow; Electrical resistance measurement; Electronics cooling; Fluid flow measurement; Hydraulic diameter; Micromachining; Semiconductor device measurement; Silicon; Temperature distribution; Thermal resistance; Water heating; evaporation; inclination angle; micro channels; thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location :
Zhuhai
Print_ISBN :
1-4244-0139-9
Electronic_ISBN :
1-4244-0140-2
Type :
conf
DOI :
10.1109/NEMS.2006.334796
Filename :
4134991
Link To Document :
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