• DocumentCode
    2054060
  • Title

    Study of Evaporation Phenomena in Micro Channels

  • Author

    Chou, Yen-Chih ; Chen, Yu-Tang ; Kang, Shung-Wen

  • Author_Institution
    Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Taipei
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    446
  • Lastpage
    449
  • Abstract
    Two-phase convective flow in micro channels has numerous promising applications such as electronic cooling. This study investigates evaporation phenomena and capillary-driven heat in a rectangular micro channels structure with hydraulic diameters of 100 ~ 250nm and length of 75mm. The micro channels made of (110)-orientated silicon is fabricated by bulk micromachining. The temperature distributions in micro channels chip structure, as well as the induced evaporation mass flow rate of water, were measured under different heat flux and inclination angle. Thermal resistances were calculated to evaluate the chip cooling performance. The experimental results show that with an increase of the imposed heat flux, the evaporation mass flow rate increases and thermal resistance decreases. The effect of channel sizes and inclination angle on the heat transfer characteristics are also examined
  • Keywords
    capillarity; evaporation; micromachining; micromechanical devices; silicon; thermal resistance; water; 75 mm; Si; bulk micromachining; capillary driven heat; chip cooling performance; electronic cooling; evaporation mass flow rate; heat flux; heat transfer characteristics; inclination angle; micro channels chip structure; two-phase convective flow; Electrical resistance measurement; Electronics cooling; Fluid flow measurement; Hydraulic diameter; Micromachining; Semiconductor device measurement; Silicon; Temperature distribution; Thermal resistance; Water heating; evaporation; inclination angle; micro channels; thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334796
  • Filename
    4134991