Title :
Improved thermal conductivity in microelectronic encapsulants
Author :
Procter, Philip ; Solc, Jitka
Author_Institution :
Dexter Electron. Mater., Olean, NY, USA
Abstract :
The interdependence of thermal conductivity with crucial properties of polymer-based encapsulants has been investigated. Selection of the filler and the resultant filler content in semiconductor molding compounds are discussed in view of the practical limitations of composite thermal conductivity. Theoretical predictions based on the Nielsen model are considered. The temperature dependence of composite thermal conductivity has been measured, and the effects of different types of polymer matrices on the temperature dependence are shown. Practical semiconductor grade molding compounds resulting from this work are extensively investigated
Keywords :
encapsulation; integrated circuit technology; packaging; thermal conductivity of solids; IC packages; Nielsen model; microelectronic encapsulants; polymer matrices; polymer-based encapsulants; semiconductor molding compounds; temperature dependence; thermal conductivity; Ceramics; Conducting materials; Electronic packaging thermal management; Microelectronics; Polymers; Silicon compounds; Thermal conductivity; Thermal expansion; Thermal factors; Thermal management;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163976
