Improved thermal conductivity in microelectronic encapsulants

Author

Procter, Philip ; Solc, Jitka

Author_Institution

Dexter Electron. Mater., Olean, NY, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

835

Lastpage

842

Abstract

The interdependence of thermal conductivity with crucial properties of polymer-based encapsulants has been investigated. Selection of the filler and the resultant filler content in semiconductor molding compounds are discussed in view of the practical limitations of composite thermal conductivity. Theoretical predictions based on the Nielsen model are considered. The temperature dependence of composite thermal conductivity has been measured, and the effects of different types of polymer matrices on the temperature dependence are shown. Practical semiconductor grade molding compounds resulting from this work are extensively investigated

Keywords

encapsulation; integrated circuit technology; packaging; thermal conductivity of solids; IC packages; Nielsen model; microelectronic encapsulants; polymer matrices; polymer-based encapsulants; semiconductor molding compounds; temperature dependence; thermal conductivity; Ceramics; Conducting materials; Electronic packaging thermal management; Microelectronics; Polymers; Silicon compounds; Thermal conductivity; Thermal expansion; Thermal factors; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163976

Filename

163976