New packaging of chip-on-board by unique printing method

Author

Okuno, Atsushi ; Nagai, Koichiro ; Ikeda, Kazuhiro ; Tsukazaki, Toshihiko ; Oyama, Noritaka ; Nakahira, Kazuhiro ; Hashimoto, Toshikazu

Author_Institution

Japan Rec Co. Ltd., Osaka, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

843

Lastpage

847

Abstract

A novel printing method which has been found to be successful in making the chip-on-board (COB) packaging for ICs has been developed. Using this technique, it has become possible to achieve less than mm height, uniform thickness, and all-in-one operation. This method is more economical than the transfer-molding method. In addition, the cost of packages is much reduced, and it is more suited to mass production. One-component epoxy-resin, called NPR-150, has been developed which is suitable for printing. Deformation of gold wires was not observed, and reliability test results showed excellent levels, comparable to the formal transfer-molding packaging

Keywords

integrated circuit technology; printed circuit manufacture; printing; surface mount technology; COB; ICs; NPR-150; SMT; chip-on-board; epoxy-resin; packaging; printing method; reliability test; Electronics packaging; Encapsulation; Epoxy resins; Integrated circuit packaging; Large scale integration; Packaging machines; Printing; Semiconductor device packaging; Surface-mount technology; Transfer molding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163977

Filename

163977