• DocumentCode
    2054633
  • Title

    A Novel Fabrication Approach for Microneedles Using Silicon Micromaching Technology

  • Author

    Wang, Xiao ; Chen, Xiaoming ; Yu, Zhenyin ; Wang, Lianwei

  • Author_Institution
    Dept. of Electron. Eng., East China Normal Univ., Shanghai
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    545
  • Lastpage
    549
  • Abstract
    Optimization of drug delivery through human skin is important in modern therapy, and with the invention of painless microneedles makes it become true. This paper presents a novel fabrication process for a tapered hollow metallic needles array using nickel plating on the silicon microneedles molds. The silicon microneedles molds, with a shank height of 150-200 mum and 300 mum center-to-center spacing are formed, using KOH etching on Si lang100rang wafer, and the etching rate can be easily controlled around 0.5 mum/min. The finale shapes of the bottom of microneedls are regular octagon. Then through the way of nickel electroplating on the silicon microneedles, the metallic needles can be fabricated. The closed tips of needles are opened by using some mechanism polishing methods. The delivery properties of the microneedles are under investigation
  • Keywords
    biomedical materials; drug delivery systems; electroplating; etching; micromachining; needles; nickel; potassium compounds; silicon; 150 to 200 micron; 300 micron; KOH; Ni; drug delivery optimization; etching rate; metallic needles; nickel electroplating; novel microneedle fabrication; painless microneedles; polishing; potassium hydroxide etching; silicon micromaching technology; silicon microneedle molds; tapered hollow metallic needle array; Drug delivery; Etching; Fabrication; Humans; Medical treatment; Needles; Nickel; Pharmaceutical technology; Silicon; Skin; electroplating; microfabrication; microneedle; nickel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334837
  • Filename
    4135014