DocumentCode
2054633
Title
A Novel Fabrication Approach for Microneedles Using Silicon Micromaching Technology
Author
Wang, Xiao ; Chen, Xiaoming ; Yu, Zhenyin ; Wang, Lianwei
Author_Institution
Dept. of Electron. Eng., East China Normal Univ., Shanghai
fYear
2006
fDate
18-21 Jan. 2006
Firstpage
545
Lastpage
549
Abstract
Optimization of drug delivery through human skin is important in modern therapy, and with the invention of painless microneedles makes it become true. This paper presents a novel fabrication process for a tapered hollow metallic needles array using nickel plating on the silicon microneedles molds. The silicon microneedles molds, with a shank height of 150-200 mum and 300 mum center-to-center spacing are formed, using KOH etching on Si lang100rang wafer, and the etching rate can be easily controlled around 0.5 mum/min. The finale shapes of the bottom of microneedls are regular octagon. Then through the way of nickel electroplating on the silicon microneedles, the metallic needles can be fabricated. The closed tips of needles are opened by using some mechanism polishing methods. The delivery properties of the microneedles are under investigation
Keywords
biomedical materials; drug delivery systems; electroplating; etching; micromachining; needles; nickel; potassium compounds; silicon; 150 to 200 micron; 300 micron; KOH; Ni; drug delivery optimization; etching rate; metallic needles; nickel electroplating; novel microneedle fabrication; painless microneedles; polishing; potassium hydroxide etching; silicon micromaching technology; silicon microneedle molds; tapered hollow metallic needle array; Drug delivery; Etching; Fabrication; Humans; Medical treatment; Needles; Nickel; Pharmaceutical technology; Silicon; Skin; electroplating; microfabrication; microneedle; nickel;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location
Zhuhai
Print_ISBN
1-4244-0139-9
Electronic_ISBN
1-4244-0140-2
Type
conf
DOI
10.1109/NEMS.2006.334837
Filename
4135014
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