A Flip-chip Assembled Microplatform for Hybrid MEMS

As MicroElectroMechanical Systems become more complicated, building them as integrated systems may not be possible and exploring new microassembly technologies becomes necessary. A novel flip-chip assembled microplatform combined with a microjig and alignment pairs is presented, both of which are fabricated with room-temperature, non-aggressive processes that can accommodate a board range of devices. With an optimized assembly sequence, 3 mum in plane position accuracy has been achieved by flip-chip positioning, coarse alignment and fine alignment enabled by various mechanisms. Moreover, the distance in z axis can also be pinpointed. Sufficient mechanical and electrical connections have been formed at bonds. It can be applied to various microcomponent and substrate material combinations, enabling hybrid MEMS efficiently and economically