DocumentCode
2054819
Title
Fatigue properties of base copper materials used in the fabrication of TAB leads
Author
Scharr, Thomas A.
Author_Institution
Motorola Inc., Phoenix, AZ, USA
fYear
1991
fDate
11-16 May 1991
Firstpage
848
Lastpage
853
Abstract
An attempt was made to characterize the mechanical properties of various types of copper foils that are used for TAB (tape automated bonding) fabrication with a special emphasis on fatigue properties. Coffin-Manson plots of strain range versus cycles-to-failure and fatigue ductility values were generated from testing of specimens. In general, the wrought foils showed a high degree of anisotropy with up to a 5 to 1 difference in cycles-to-failure between machined and cross-machined directions. The anisotropy was observed to be much lower in the low-temperature annealable wrought foils, about 1.5 to 1. Observed grain structures of these materials correlated to their anisotropic behavior, with the low-temperature annealable materials showing smaller amounts of directionality in their microstructure. The ED (electrodeposited) coppers tested had fine-grained equiaxial structures with no significant effects from direction of test. Of the samples tested, the ED coppers performed better at low-cycle, high strain rates, while the wrought coppers had the best performance at high-cycle, low strain rates. The results of this work show that the fatigue performance of a particular type or temper of copper is an important consideration when designing a TAB tape
Keywords
copper; fatigue; surface mount technology; tape automated bonding; Coffin-Manson plots; Cu foils; SMT; TAB leads; TAB tape; anisotropic behavior; cycles-to-failure; electrodeposited Cu; fabrication; fatigue ductility values; fatigue properties; fine-grained equiaxial structures; grain structures; low-temperature annealable materials; mechanical properties; strain range; tape automated bonding; wrought foils; Anisotropic magnetoresistance; Annealing; Bonding; Capacitive sensors; Copper; Fabrication; Fatigue; Mechanical factors; Microstructure; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163978
Filename
163978
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