Title :
Fatigue properties of base copper materials used in the fabrication of TAB leads
Author :
Scharr, Thomas A.
Author_Institution :
Motorola Inc., Phoenix, AZ, USA
Abstract :
An attempt was made to characterize the mechanical properties of various types of copper foils that are used for TAB (tape automated bonding) fabrication with a special emphasis on fatigue properties. Coffin-Manson plots of strain range versus cycles-to-failure and fatigue ductility values were generated from testing of specimens. In general, the wrought foils showed a high degree of anisotropy with up to a 5 to 1 difference in cycles-to-failure between machined and cross-machined directions. The anisotropy was observed to be much lower in the low-temperature annealable wrought foils, about 1.5 to 1. Observed grain structures of these materials correlated to their anisotropic behavior, with the low-temperature annealable materials showing smaller amounts of directionality in their microstructure. The ED (electrodeposited) coppers tested had fine-grained equiaxial structures with no significant effects from direction of test. Of the samples tested, the ED coppers performed better at low-cycle, high strain rates, while the wrought coppers had the best performance at high-cycle, low strain rates. The results of this work show that the fatigue performance of a particular type or temper of copper is an important consideration when designing a TAB tape
Keywords :
copper; fatigue; surface mount technology; tape automated bonding; Coffin-Manson plots; Cu foils; SMT; TAB leads; TAB tape; anisotropic behavior; cycles-to-failure; electrodeposited Cu; fabrication; fatigue ductility values; fatigue properties; fine-grained equiaxial structures; grain structures; low-temperature annealable materials; mechanical properties; strain range; tape automated bonding; wrought foils; Anisotropic magnetoresistance; Annealing; Bonding; Capacitive sensors; Copper; Fabrication; Fatigue; Mechanical factors; Microstructure; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163978