• DocumentCode
    2054819
  • Title

    Fatigue properties of base copper materials used in the fabrication of TAB leads

  • Author

    Scharr, Thomas A.

  • Author_Institution
    Motorola Inc., Phoenix, AZ, USA
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    848
  • Lastpage
    853
  • Abstract
    An attempt was made to characterize the mechanical properties of various types of copper foils that are used for TAB (tape automated bonding) fabrication with a special emphasis on fatigue properties. Coffin-Manson plots of strain range versus cycles-to-failure and fatigue ductility values were generated from testing of specimens. In general, the wrought foils showed a high degree of anisotropy with up to a 5 to 1 difference in cycles-to-failure between machined and cross-machined directions. The anisotropy was observed to be much lower in the low-temperature annealable wrought foils, about 1.5 to 1. Observed grain structures of these materials correlated to their anisotropic behavior, with the low-temperature annealable materials showing smaller amounts of directionality in their microstructure. The ED (electrodeposited) coppers tested had fine-grained equiaxial structures with no significant effects from direction of test. Of the samples tested, the ED coppers performed better at low-cycle, high strain rates, while the wrought coppers had the best performance at high-cycle, low strain rates. The results of this work show that the fatigue performance of a particular type or temper of copper is an important consideration when designing a TAB tape
  • Keywords
    copper; fatigue; surface mount technology; tape automated bonding; Coffin-Manson plots; Cu foils; SMT; TAB leads; TAB tape; anisotropic behavior; cycles-to-failure; electrodeposited Cu; fabrication; fatigue ductility values; fatigue properties; fine-grained equiaxial structures; grain structures; low-temperature annealable materials; mechanical properties; strain range; tape automated bonding; wrought foils; Anisotropic magnetoresistance; Annealing; Bonding; Capacitive sensors; Copper; Fabrication; Fatigue; Mechanical factors; Microstructure; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163978
  • Filename
    163978