• DocumentCode
    2055162
  • Title

    A High Performance Uncooled a-Si TFT Infrared Sensor

  • Author

    Han, Lin ; Xing Ming Liu ; Tian Liu, Li

  • Author_Institution
    Inst. of Microelectron., Tsinghua Univ.
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    631
  • Lastpage
    634
  • Abstract
    This paper reports the theory, fabrication and testing of a novel uncooled infrared (IR) sensor using amorphous silicon thin film transistors (a-Si TFTs) as the active elements. The measured temperature coefficient of the channel current (TCC) of the a-Si TFT is about 4.18%/K at room temperature. What´s more, finger-cross TFT is designed, which can greatly improve the detectivity of uncooled infrared sensor by increasing the ratio of channel width to length (W/L). Nano-TiO2 /polyimide (PI) hybrid membrane is applied in infrared absorption layer, which increases infrared absorptance by about 15%. A new thermal-isolation materials-polyimide is applied in uncooled infrared sensor, which not only has good thermal-isolation, but also simplifies the fabrication process and improves the yield. The whole process of a-Si TFT uncooled infrared sensor is compatible with the standard IC process. Preliminary experimental results show that a detectivity of 1.0 times 109cmHzfrac12/W is achieved at a chopping frequency of 30 Hz
  • Keywords
    infrared detectors; silicon compounds; thin film transistors; titanium compounds; 293 to 298 K; 30 Hz; Si; TiO2; a-Si TFT; infrared sensor; membrane; polyimide; temperature coefficient; thermal-isolation; thin film transistors; Amorphous silicon; Current measurement; Fabrication; Infrared detectors; Infrared sensors; Temperature measurement; Temperature sensors; Testing; Thin film sensors; Thin film transistors; TCC; a-Si TFT; nano-TiO2/PI hybrid membrane; polyimide; uncolled infrared sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334861
  • Filename
    4135034