Title :
InP waveguide-integrated pin-photodiode hybrid packaged with an HBT-DEMUX-chip for receiver modules of 80–100 Gb/s data rates
Author :
Mekonnen, G.G. ; Hüttl, B. ; Bach, H.-G. ; Pech, D. ; Rosin, T. ; Schubert, C. ; Konczykowska, A. ; Jorge, F. ; Riet, M.
Author_Institution :
Fraunhofer Inst. for Telecommun., Heinrich-Hertz-Inst., Berlin
Abstract :
A waveguide-integrated photodetector is hybrid packaged with an HBT-DEMUX into a receiver module for system experiments. The pin-DEMUX module has demonstrated an excellent RF behaviour at bit rates up to 80 Gb/s.
Keywords :
III-V semiconductors; bipolar integrated circuits; demultiplexing; heterojunction bipolar transistors; indium compounds; integrated optoelectronics; optical receivers; optical waveguides; p-i-n photodiodes; photodetectors; HBT-DEMUX-chip; InP; RF behaviour; bit rate 80 Gbit/s to 100 Gbit/s; hybrid packaged pin photodetector chip; pin-DEMUX module; receiver module; system experiments; waveguide-integrated pin-photodiode; Bonding; Clocks; Demultiplexing; Detectors; Diodes; Indium phosphide; Packaging; Photodetectors; Photodiodes; Radio frequency;
Conference_Titel :
Optical Communication, 2008. ECOC 2008. 34th European Conference on
Conference_Location :
Brussels
Print_ISBN :
978-1-4244-2227-2
Electronic_ISBN :
978-1-4244-2228-9
DOI :
10.1109/ECOC.2008.4729277
