DocumentCode :
2056439
Title :
The Effects of Driving Waveform of Piezoelectric Industrial Inkjet Head for Fine Patterns
Author :
Kim, Youngjae ; Sim, Wonchul ; Park, Changsung ; Yoo, Youngseuck ; Joung, Jaewoo ; Oh, Yongsoo
Author_Institution :
eMD Lab. Central R&D Inst., Suwon
fYear :
2006
fDate :
18-21 Jan. 2006
Firstpage :
826
Lastpage :
831
Abstract :
This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristics were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(laser doppler vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025N/m, it is possible to eject stable droplets up to 20kHz, 4.4m/s and above 8pL at the different applied driving waveforms.
Keywords :
ink jet printers; micromechanical devices; nozzles; piezoelectric transducers; silicon-on-insulator; MEMS process; SOI wafers; actuators; droplet velocity maximization; dynamic signal analyzer; jetting characteristics; laser doppler vibrometer; mechanical design; mechanical simulation; piezoelectric bend mode inkjet; resonance frequency; silicon direct bonding method; surface tension; voltage response; Actuators; Ceramics; Design optimization; Firing; Frequency; Ink; Micromechanical devices; Silicon; Voltage; Wafer bonding; MEMS; droplet; inkjet head; piezoelectric; waveform;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location :
Zhuhai
Print_ISBN :
1-4244-0139-9
Electronic_ISBN :
1-4244-0140-2
Type :
conf
DOI :
10.1109/NEMS.2006.334905
Filename :
4135078
Link To Document :
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