Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications

Author

Hermann, Sascha ; Fiedler, Holger ; Haibo, Yu ; Loschek, Sergei ; Bonitz, Jens ; Schulz, Stefan E. ; Gessner, Thomas

Author_Institution

Center for Microtechnologies (ZfM), Chemnitz Univ. of Technol., Chemnitz, Germany

fYear

2012

fDate

20-23 March 2012

Firstpage

1

Lastpage

5

Abstract

In this work we give an overview about recent developments in the integration technology of CNTs. We focus on wafer level approaches with the CVD and DEP method for growing as well as depositing CNTs in a defined way. So that we present methods to manipulate CNT growth structure, growth mode as well as growth inhibition in thermal CVD processes. This is highlighted by a unique growth structure opening new possibilities for CNT integration. Likewise, we show recent developments in scaling up the DEP method on wafer level. We round it up with the fabrication of CNT vias and MEMS structures containing CNT sensor elements.

Keywords

carbon nanotubes; chemical vapour deposition; nanosensors; wafer level packaging; CVD method; DEP method; carbon nanotubes; electronic applications; integration technology; sensor applications; thermal CVD processes; wafer level approaches; Carbon; Carbon nanotubes; Dielectrophoresis; Electrodes; Films; Nickel; CNT; CVD; DEP; integration; interconnects; sensor; wafer level;

fLanguage

English

Publisher

ieee

Conference_Titel

Systems, Signals and Devices (SSD), 2012 9th International Multi-Conference on

Conference_Location

Chemnitz

Print_ISBN

978-1-4673-1590-6

Electronic_ISBN

978-1-4673-1589-0

Type

conf

DOI

10.1109/SSD.2012.6198090

Filename

6198090