Title :
Novel solvent bonded low cost pigtailed PIN module
Author :
Jiang, Ching-Long John ; O´Neill, Steve ; Mak, Eric ; Reysen, Bill
Author_Institution :
Lytel Div., AMP Inc., Somerville, NJ, USA
Abstract :
In order to lower the cost of optoelectronic packaging, a novel solvent bonding technique has been developed to bond two thermoplastic surfaces, permanently, with a room-temperature cure of approximately 30 seconds. This technique has been applied to a pigtailed PIN module with a canted fiber. A model has been developed as a design tool to simulate the responsivity and the optical back reflection of various configurations of different angled fibers and canted angles with respect to the PIN detector. Close agreement between simulations and measurements of responsivity and optical back reflection has been achieved. With this design tool, a low cost pigtailed PIN module utilizing a novel solvent bonding technique has been developed to meet CATV applications
Keywords :
modules; p-i-n photodiodes; packaging; photodetectors; CATV; PIN detector; canted fiber; curing; design; low cost pigtailed module; optical back reflection; optoelectronic packaging; responsivity; solvent bonding; thermoplastic surface; Assembly; Bonding; Costs; Curing; Optical feedback; Optical fibers; Optical receivers; Optical reflection; Optical transmitters; Solvents;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606131
