• DocumentCode
    2057296
  • Title

    Monolithic Integration of Micro-cantilever with Conditioning Circuits based on SOI Techniques

  • Author

    Zhang, Haitao ; Yu, Xiaomei ; Wang, Xiaobao ; Zhang, Dacheng

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    970
  • Lastpage
    973
  • Abstract
    This paper presents a monolithic integration of piezoresistive micro-cantilevers with CMOS (complementary metal oxide semiconductor) analog amplifier and digital multiplexer based on the techniques of SOI (silicon on insulator) CMOS and MEMS (micro electronic mechanical system). The three modules, signal detection, signal selection and signal amplification, of the design are proposed step by step. Then, SOI-CMOS-PD (partially depleted) is compared with SOI-CMOS-FD (fully depleted) to ensure its advantages in analog IC. And the post-CMOS process is designed as manufacture solution. Finally, simulations and test results are presented to prove the availability of the whole project.
  • Keywords
    CMOS integrated circuits; amplifiers; cantilevers; micromechanical devices; piezoresistive devices; silicon-on-insulator; SOI Techniques; analog amplifier; complementary metal oxide semiconductor; conditioning circuits; digital multiplexer; fully depleted CMOS; micro electronic mechanical system; monolithic integration; partially depleted CMOS; piezoresistive micro-cantilevers; signal amplification; signal detection; signal selection; silicon on insulator; Mechanical systems; Metal-insulator structures; Micromechanical devices; Monolithic integrated circuits; Multiplexing; Piezoresistance; Semiconductor optical amplifiers; Signal design; Signal detection; Silicon on insulator technology; Micro-cantilever; SOI; circuits; integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334576
  • Filename
    4135109