• DocumentCode
    2057337
  • Title

    An Improved 3D Simulator for MEMS Processes

  • Author

    Tan, Yiyong ; Li, Zhihong ; Wang, Lei ; Lu, Guizhang ; Zhao, Xin

  • Author_Institution
    Inst. of Robot. & Inf. Autom. Syst., Nankai Univ., Tianjin
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    974
  • Lastpage
    978
  • Abstract
    A new improved comprehensive 3D surface simulator is presented for different MEMS processes. The simulator consists of three parts: the common surface evolution models, 3D represent layer, and physical processes model interface. The surface evolution models including faster surface string model and material cell-removal model, function as a common 3D surface and structure generator, segment control and loops are detectible and solved by the improved evolution algorithm. A WTK virtual environment is used as the 3D display interface for representing the 3D-results generated in surface evolution. Different physical models, experiment parameters, materials and so on, will be described in the data layer. Using this simulator, the isotropic etching, anisotropic etching, deposition and DRIE processes are simulated.
  • Keywords
    evolutionary computation; micromechanical devices; sputter etching; 3D display interface; 3D represent layer; 3D simulator; 3D surface simulator; DRIE processes; MEMS processes; WTK virtual environment; anisotropic etching; evolution algorithm; material cell-removal model; physical processes model interface; surface evolution models; surface string model; Computational modeling; Etching; Micromechanical devices; Polymers; Ray tracing; Silicon; Solid modeling; Surface topography; Systems engineering and theory; Three dimensional displays; 3D Simulator; ICP; MEMS; Process;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334577
  • Filename
    4135110