• DocumentCode
    2057425
  • Title

    Silicon quantum dot devices

  • Author

    Oda, Shunri

  • Author_Institution
    Dept. of Phys. Electron., Tokyo Inst. of Technol., Tokyo
  • fYear
    2008
  • fDate
    11-14 May 2008
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    Quantum dot structures, where electrons are confined three-dimensionally in the below 10 nm scale, show characteristics quite different from conventional bulk structures. Recent progress in the fabrication technology of silicon nanostructures has made possible observations of novel electrical and optical properties of silicon quantum dots, such as single electron tunneling, ballistic transport, visible photoluminescence and electron emission. Electron transport and photonic properties of silicon nanocrystals prepared by plasma processes are described with particular emphasis on fabrication of monodispersed silicon nanocrystals, high-density assembly of silicon quantum dots, silicon nanodot memory, NEMS devices, and silicon photonic devices.
  • Keywords
    ballistic transport; electron emission; nanostructured materials; nanotechnology; optoelectronic devices; photoluminescence; semiconductor quantum dots; semiconductor storage; silicon; vacuum microelectronics; NEMS devices; Si; ballistic transport; conventional bulk structures; electrical properties; electron emission; electron transport; monodispersed silicon nanocrystals; optical properties; photonic properties; plasma processes; quantum dot structures; silicon nanodot memory; silicon nanostructure fabrication technology; silicon photonic devices; silicon quantum dot devices; single electron tunneling; visible photoluminescence; Electron emission; Electron optics; Nanocrystals; Nanostructures; Optical device fabrication; Plasma properties; Quantum dots; Silicon; Stimulated emission; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2008. MIEL 2008. 26th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-1881-7
  • Electronic_ISBN
    978-1-4244-1882-4
  • Type

    conf

  • DOI
    10.1109/ICMEL.2008.4559218
  • Filename
    4559218