Title :
One-step polymerization of aniline and its conducting blends in organic system
Author :
Lee, Bo Hyun ; Kim, Tae Young ; Kim, Jong Eun ; Suh, Kwang S.
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Univ., Seoul, South Korea
Abstract :
Stable polyaniline-dodecylbenzenesulfonic acid (PANI -DBSA) fully dissolved in toluene was obtained by a direct one-step emulsion polymerization technique. The polymerization of aniline was carried out in an emulsion comprising water, toluene and DBSA acting both as a surfactant and a dopant for PANI. After the proper washing process was performed, the conductivity of obtained PANI-DBSA complex increased with an increase in the APS/aniline molar ratio and the DBSA/aniline molar ratio. The UV-vis absorption spectra of the PANI-DBSA complex also supported these results. PANI-DBSA/polymer (polystyrene and styrene-butadiene copolymer) blends were prepared by mixing PANI-DBSA complex with polymer in toluene. These blends exhibited relatively high conductivity of 10-2 S/cm at a low PANI-DBSA content (1-5 wt.%)
Keywords :
conducting polymers; electrical conductivity; emulsions; materials preparation; organic compounds; organic semiconductors; polymer blends; polymer films; polymerisation; surface conductivity; surfactants; ultraviolet spectra; visible spectra; 10-2 S/cm; APS/aniline molar ratio; DBSA; DBSA/aniline molar ratio; PANI -DBSA; PANI-DBSA/polymer blends; UV-vis absorption spectra; aniline; aniline conducting blends; conductivity; emulsion; one-step emulsion polymerization technique; one-step polymerization; polyaniline-dodecylbenzenesulfonic acid; polystyrene; styrene-butadiene copolymer; surface resistance; surfactant; toluene; water; Atomic force microscopy; Chemicals; Coatings; Conducting materials; Conductivity; Electrical resistance measurement; Materials science and technology; Plastic insulation; Polymer films; Surface resistance;
Conference_Titel :
Electrical Insulating Materials, 2001. (ISEIM 2001). Proceedings of 2001 International Symposium on
Conference_Location :
Himeji
Print_ISBN :
4-88686-053-2
DOI :
10.1109/ISEIM.2001.973707