Cu/Sn Isothermal Solidification Technology for Hermetic Packaging of MEMS

Author

Li, Li ; Jiao, Jiwei ; Luo, Le ; Wang, Yuelin

Author_Institution

State Key Labs. of Transducer Technol., Chinese Acad. of Sci., Shanghai

fYear

2006

fDate

18-21 Jan. 2006

Firstpage

1133

Lastpage

1137

Abstract

This paper introduces a novel wafer-level hermetic packaging technology for MEMS based on Cu/Sn isothermal solidification (IS) technology. We designed the structure of the intermediate multilayer and the pattern of sealing rings, optimized the bonding process, and analyzed some key factors affecting the hermeticity, such as the dimension of the sealing rings. Successful Cu/Sn IS bonding was realized at a low bonding temperature of 350degC under the optimal conditions. High shear strength of 27.7 MPa and excellent leak rate of around 2times10^-9 atm cc/s have been achieved, which meet the requirements of MIL-STD-883E. Finally we designed and manufactured the micro resonator based on the Cu/Sn IS technology

Keywords

bonding processes; copper alloys; hermetic seals; isothermal transformations; micromechanical resonators; solidification; tin alloys; wafer level packaging; 350 C; Cu-Sn; MIL-STD-883E; bonding process optimization; bonding temperature; copper-tin isothermal solidification; hermeticity; intermediate multilayer structure; leak rate; microresonator; sealing ring pattern; shear strength; wafer level hermetic MEMS packaging; Bonding processes; Design optimization; Isothermal processes; Micromechanical devices; Nonhomogeneous media; Packaging; Pattern analysis; Temperature; Tin; Wafer scale integration; Isothermal solidification (IS); MEMS; hermetic packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on

Conference_Location

Zhuhai

Print_ISBN

1-4244-0139-9

Electronic_ISBN

1-4244-0140-2

Type

conf

DOI

10.1109/NEMS.2006.334665

Filename

4135147