DocumentCode :
2058637
Title :
Characterization of nano-meter scale roughness of CVD silicon and silicon dioxide films for 3-D device integration
Author :
Ilhan, H. Tolga ; Nasrullah, Jawad ; Linscott, Ivan ; Tyler, G. Leonard
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., CA, USA
Volume :
2
fYear :
2003
fDate :
12-14 Aug. 2003
Firstpage :
539
Abstract :
A wavelet-based approach for characterization of surface roughness of thin films of Si and SiO2, describes a local sharp variation in atomic force microscope (AFM) scans as a combination of local Holder exponent and summit decay rate. Increased deposition time, in combination with higher nucleation rate, and etched-back low pressure chemical vapor deposition (LPCVD) films result in increasingly smooth summits and less overall roughness. No roughness dependence on surface cleaning method is observed.
Keywords :
CVD coatings; atomic force microscopy; elemental semiconductors; nanotechnology; nucleation; semiconductor process modelling; semiconductor thin films; silicon; silicon compounds; surface cleaning; surface roughness; wavelet transforms; 3D device integration; AFM; CVD silicon films; LPCVD films; Si; Si thin films; SiO2; SiO2 thin films; atomic force microscopy; deposition time; etched back low pressure chemical vapor deposition films; local Holder exponent; local sharp variation; nanometer scale roughness; nucleation rate; silicon dioxide films; summit decay rate; surface cleaning method; surface roughness; wavelet analysis; Atomic force microscopy; Atomic layer deposition; Nanoscale devices; Rough surfaces; Semiconductor films; Semiconductor thin films; Silicon compounds; Surface cleaning; Surface roughness; Surface waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on
Print_ISBN :
0-7803-7976-4
Type :
conf
DOI :
10.1109/NANO.2003.1230966
Filename :
1230966
Link To Document :
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