Title :
Integration of IEEE STD.11149.1 and mixed-signal test architectures
Author :
Cheek, David J. ; Dandapani, R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado Univ., Colorado Springs, CO, USA
Abstract :
It is shown that the TMS pin of IEEE Std. 1149.1 can also be-used for providing stimulus during analog measurements using the architectures of [Park93] and [Lu94]. This results in the saving of one test pin for these architectures. Simulation results show that mixed-signal testing can be safely performed using the new approach without compromising the effectiveness of the approaches of [Park93] and [Lu94]
Keywords :
IEEE standards; automatic testing; design for testability; integrated circuit design; integrated circuit interconnections; integrated circuit testing; mixed analogue-digital integrated circuits; IC design; IC level testing; IEEE STD.11149.1; TMS pin; analog measurements; interconnect failures; mixed-signal test architectures; test effectiveness; Circuit simulation; Circuit testing; Current measurement; Digital integrated circuits; Integrated circuit interconnections; Performance evaluation; Pins; Springs; Switches; Voltage;
Conference_Titel :
Test Conference, 1995. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2992-9
DOI :
10.1109/TEST.1995.529885
