Title :
The mechanical properties of thin polymer film for nanoimprinting lithography by nanoindentation
Author :
Lee, H.J. ; Hur, S. ; Han, S.W. ; Kim, J.H. ; Oh, C.-S. ; Ko, S.G.
Author_Institution :
Korea Inst. of Machinery & Mater., Daejeon, South Korea
Abstract :
Two thin polymer films (mr-I-8030 and mr-I-9030) for nanoimprinting lithography are coated on 4 inches silicon wafers. Nanoindentation tests are performed to measure the mechanical properties, Young´s modulus and hardness, of these thin films having the thicknesses of around 130, 200, and 400 nm. The primary elastic modulus and the viscoelastic properties are derived from the creep. The modulus values obtained by these methods are compared. The plastic deformation of these films after indentation is analyzed by using a scanning probe microscope.
Keywords :
Young´s modulus; creep; hardness; indentation; plastic deformation; polymer films; scanning probe microscopy; viscoelasticity; 130 nm; 200 nm; 400 nm; Si; Young´s modulus; creep; elastic modulus; hardness; mechanical properties; nanoimprinting lithography; nanoindentation; plastic deformation; scanning probe microscopy; silicon wafers; thin polymer films; viscoelastic properties; Lithography; Mechanical factors; Mechanical variables measurement; Performance evaluation; Plastic films; Polymer films; Silicon; Testing; Thickness measurement; Viscosity;
Conference_Titel :
Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on
Print_ISBN :
0-7803-7976-4
DOI :
10.1109/NANO.2003.1230968
