DocumentCode :
2058817
Title :
Failure analysis of high power white LEDs
Author :
Cassanelli, G. ; Mura, G. ; Fantini, F. ; Vanzi, M.
Author_Institution :
Univ. of Modena & Reggio Emilia, Modena
fYear :
2008
fDate :
11-14 May 2008
Firstpage :
255
Lastpage :
257
Abstract :
Moisture-induced silver reactions have been identified as a fast degradation mechanism in commercial plastic packaged white LEDs, that passed a standard incoming lot inspection but resulted all degraded at the switching-on after mounting on the final boards. The source of the contaminant (Sulphur) is not explained by any part of the available history of the devices in the lot. Anyway, each one of three possible scenarios depicts a reliability issue that escaped the process monitors and reached the shelf.
Keywords :
failure analysis; inspection; light emitting diodes; plastic packaging; failure analysis; high power white LED; light emitting diode; lot inspection; moisture-induced silver reactions; plastic packaging; process monitoring; Costs; Degradation; Failure analysis; Inspection; LED lamps; Light emitting diodes; Light sources; Lighting; Packaging; Phosphors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location :
Nis
Print_ISBN :
978-1-4244-1881-7
Electronic_ISBN :
978-1-4244-1882-4
Type :
conf
DOI :
10.1109/ICMEL.2008.4559272
Filename :
4559272
Link To Document :
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