• DocumentCode
    2059027
  • Title

    Minimally Invasive Electrical Impedance Tomography - Promising Way to Decrease Diagnostics Uncertainty

  • Author

    Liu, Ran ; Liu, Jing ; Wang, Guangzhi ; Ding, Hui

  • Author_Institution
    Dept. of Biomed. Eng., Tsinghua Univ., Beijing
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    1250
  • Lastpage
    1253
  • Abstract
    Regular electrical impedance tomography (EIT) is based on the surface electrodes which results in long application times, long stabilization times, and high ESEI. Clinically relevant information in electrical impedance tomography is diluted by the electrical properties of stratum corneum. Eliminating stratum corneum would improve the signals from the tissue. In this paper, a new concept and possible technology - minimally invasive electrical impedance tomography based on micromachined needle electrodes is described to decrease diagnostics uncertainty. Microneedle electrodes are penetrated into the skin, and compared to regular EIT, can obtained minimal ESEI required. Otherwise, the object of tomography would be extended to the local body or the micro tissue, such as a cell, to realize micro imaging. Human body electromagnetic field models under different electrode contact modes on human body are also built and analysed in the paper
  • Keywords
    biomedical electrodes; electric impedance imaging; microelectrodes; needles; patient diagnosis; diagnostics uncertainty; human body electromagnetic field models; micro imaging; micromachining; microneedle electrodes; minimally invasive electrical impedance tomography; stratum corneum; tissue signals; Biological system modeling; Electrodes; Electromagnetic fields; Humans; Minimally invasive surgery; Needles; Skin; Surface impedance; Tomography; Uncertainty; EM field model; electrical impedance tomography; microneedles; minimally invasive; style;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334709
  • Filename
    4135173