DocumentCode
2059208
Title
Monolithic High-Aspect-Ratio Embedded Parylene Channel Technology: Fabrication, Integration, and Applications
Author
Chen, Po-Jui ; Tai, Yu-Chong
Author_Institution
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA
fYear
2006
fDate
18-21 Jan. 2006
Firstpage
1284
Lastpage
1287
Abstract
This paper presents a novel channel fabrication technology of monolithic bulk-micromachined embedded channels. Based upon implementing two-step complementary dry etching technique and conformal parylene C layer deposition, high-aspect-ratio (internal channel height/internal channel width, greater than 20) polymer channels with uniform quasi-rectangular sidewalls have been successfully fabricated in one silicon wafer. The fabrication is completely compatible with further lithographic CMOS/MEMS process, which enables its total integration with on-chip micro sensors/actuators/structures for lab-on-a-chip applications. An exemplary process has been successfully demonstrated to verify the possibility of combining bulk micromachining and surface micromachining. This proposed formation of channels can be extensively used as beam elements in micromechanical devices or microcolumns for high-performance/high-throughput chip-based separation analysis. A spiral parylene column longer than 1.1 m embedded in a 3.3 mm times 3.3 mm chip has been presented as a prospective element in micro gas-chromatography (muGC)
Keywords
lab-on-a-chip; micromachining; micromechanical devices; monolithic integrated circuits; CMOS; MEMS; aspect-ratio; dry etching; embedded channels; lab-on-a-chip applications; layer deposition; lithography; micro gas-chromatography; microactuators; micromachining; micromechanical devices; microsensors; parylene; Actuators; CMOS process; Dry etching; Fabrication; Lab-on-a-chip; Micromachining; Micromechanical devices; Polymers; Silicon; Spirals; embedded channel; high-aspect-ratio; monolithic; parylene;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location
Zhuhai
Print_ISBN
1-4244-0139-9
Electronic_ISBN
1-4244-0140-2
Type
conf
DOI
10.1109/NEMS.2006.334716
Filename
4135180
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