MCM compute node thermal failure-design or test problem?

Author

Sayre, Edward P.

Author_Institution

North East Syst. Associates Inc., USA

fYear

1996

fDate

20-25 Oct 1996

Firstpage

834

Lastpage

838

Abstract

This paper is a unique documentation of a MCM thermal failure due to inadequate signal integrity of the test fixture used for at-speed testing. An accurate SPICE model of the rest fixture and MCM was developed utilizing TDR techniques and analytical representations of the test fixture elements. The SPICE analysis showed clearly that impedance mismatches within the fixture components and MCM carrier and test socket caused a significant increase in the RMS driver current and produced a 33% increase in power dissipation in each MCM I/O driver. The additional dissipation, in conjunction with the elevated temperature test environment caused the thermal failures observed during at-speed testing

Keywords

SPICE; digital simulation; failure analysis; multichip modules; thermal stresses; time-domain reflectometry; MCM I/O driver; MCM carrier; MCM thermal failure; RMS driver current; SPICE analysis; SPICE model; TDR techniques; analytical representations; at-speed testing; dissipation; fixture components; impedance mismatches; power dissipation; signal integrity; temperature test environment; test fixture elements; test socket; thermal failure; thermal failures; Failure analysis; Fixtures; Impedance; Power dissipation; Production; SPICE; Sockets; System testing; Temperature; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1996. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-3541-4

Type

conf

DOI

10.1109/TEST.1996.557144

Filename

557144