Study of encapsulating system for diversified area bump packages

With increasing numbers of handy electronic equipment in the market, the IC packages have become smaller size and require higher I/O for additional functions. The ultimate goal of IC assembly is direct chip mounting on Printed Circuit Board with flip chip interconnection. However the market is so complicated to expand bare chip mounting. The standardization of outer I/O in an IC package is one of the big advantage of IC packaging. Under above circumstance, area bump plastic packages such as Over Molded Plastic Ball Grid Array (OM-PBGA), and Cavity Down PBGA (CD-PBGA), and Flip Chip PBGA (FC-PBGA) are focused as standardized small body high I/O packages for future high end applications. Among area bump packages, the major one is OM-PBGA. The high potential package for high performance IC devices is CD-PBGA. For CD-PBGA, liquid compound is mainly used as IC encapsulant. And furthermore, FC-PBGA which has flip chip inner connection is available now as an option of the diversified application. Individual design conception are required for each IC encapsulating system and application. This paper is discusses about plastic IC encapsulation for diversified area bump packages explained here from the stand point of the material and the system