• DocumentCode
    2059785
  • Title

    Molecular beam epitaxial growth of GaN on 3C-SiC/Si(111) substrates using a thick AlN buffer layer

  • Author

    Gao, Xin ; Li, Jinmin ; Sun, Guosheng ; Zhang, Nanhong ; Wang, Lei ; Zhao, Wanshun ; Zeng, Yiping

  • Author_Institution
    Novel Semicond. Mat. Lab., Chinese Acad. of Sci., Beijing, China
  • fYear
    2004
  • fDate
    20-25 Sept. 2004
  • Firstpage
    49
  • Lastpage
    52
  • Abstract
    Hexagonal GaN films (∼3 μm) were grown on 3C-SiC/Si(111) and carbonized Si(111) substrates using a thick AlN buffer. Cracks are observed on the surface of the GaN film grown on the carbonized Si(111), while no cracks are visible on the 3C-SiC/Si(111). XRD exhibits polycrystalline nature of the GaN film grown on the carbonized Si(111) due to poorer crystalline quality of this substrate. Raman spectra reveal that all GaN layers are under tensile stress, and the GaN layer grown on 3C-SiC/Si(111) shows a very low stress value of σxx=0.65 GPa. In low-temperature photoluminescence spectra the remarkable donor-acceptor-pair recombination and yellow band can be attributed to the incorporation of Si impurities from the decomposition of SiC.
  • Keywords
    III-V semiconductors; Raman spectra; X-ray diffraction; buffer layers; electron-hole recombination; gallium compounds; impurities; molecular beam epitaxial growth; photoluminescence; semiconductor epitaxial layers; semiconductor growth; surface cracks; wide band gap semiconductors; 0.65 GPa; GaN; Raman spectra; SiC-Si-AlN; XRD; buffer layer; cracks; decomposition; donor-acceptor recombination; hexagonal GaN films; impurities; molecular beam epitaxial growth; photoluminescence spectra; tensile stress; yellow band; Buffer layers; Crystallization; Gallium nitride; Impurities; Molecular beam epitaxial growth; Photoluminescence; Substrates; Surface cracks; Tensile stress; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconducting and Insulating Materials, 2004. SIMC-XIII-2004. 13th International Conference on
  • Print_ISBN
    0-7803-8668-X
  • Type

    conf

  • DOI
    10.1109/SIM.2005.1511383
  • Filename
    1511383