Title :
2.3 A 130-to-180GHz 0.0035mm2 SPDT switch with 3.3dB loss and 23.7dB isolation in 65nm bulk CMOS
Author :
Fanyi Meng ; Kaixue Ma ; Kiat Seng Yeo
Author_Institution :
Nanyang Technol. Univ., Singapore, Singapore
Abstract :
Single-pole double-throw (SPDT) switches are a key building block for enabling transceiver time-division duplexing (TDD) when operated as a T/R switch or for eliminating imager fluctuations when operated as a Dicke switch. To provide acceptable compromises of IMF, Pout and sensitivity in transceivers or imagers, the switches are required to feature an insertion loss of ~3dB and an isolation of ~20dB. Recently, mm-Wave/sub-mm-Wave transceiver and imager integrated circuits have gradually migrated to silicon platforms for low-cost consumer markets [1,2]. However, the associated SPDT switches operating beyond 110GHz are developed using advanced SOI or SiGe HBT technologies [3,4] and rarely implemented in CMOS due to the lossy substrate and poor transistor characteristics [2,5].
Keywords :
CMOS integrated circuits; Ge-Si alloys; elemental semiconductors; field effect MIMIC; heterojunction bipolar transistors; isolation technology; microwave switches; millimetre wave devices; radio transceivers; silicon; time division multiplexing; SOI HBT technologies; SPDT switch; Si; SiGe; SiGe HBT technologies; bulk CMOS; frequency 130 GHz to 180 GHz; imager integrated circuits; insertion loss; isolation; silicon platforms; single-pole double-throw switches; size 65 nm; transceiver time-division duplexing; Couplings; Insertion loss; Loss measurement; Switches; Switching circuits; Topology; Transistors;
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
DOI :
10.1109/ISSCC.2015.7062852