Spatial Distribution Measurement of Dynamic Voltage Drop Caused by Pulse and Periodic Injection of Spot Noise

Author

Takeuchi, Ken ; Shimada, Masanobu ; Sato, Takao ; Katsuki, Y. ; Yoshikawa, Hideki ; Matsushita, Haruna

Author_Institution

Renesas Electron. Corp., Tokyo, Japan

Volume

21

Issue

1

fYear

2013

fDate

Jan. 2013

Firstpage

164

Lastpage

168

Abstract

This paper presents measured results of dynamic voltage drop caused by pulse and periodic injection of spot noise. The test structure being fabricated by a 45 nm low-power process has 1024 delay probes to measure spatial distributions in response to the spot-noise generation. The test structure is the advanced version of our predecessor being fabricated by a 65-nm node, and can trace changes in the spatial distributions with time after the noise injection. The measured results are compared with SPICE simulations, in which package/socket LCR as well as power-line RC within the die is modeled. It is found that the simple model agrees well with the measured results.

Keywords

SPICE; circuit noise; electric potential; SPICE simulation; delay probes; die; dynamic voltage drop; noise injection; package/socket LCR; periodic injection; power line RC; spatial distribution measurement; spot noise generation; test structure; Clocks; Delay; Noise; Noise measurement; Probes; Very large scale integration; Voltage measurement; Dynamic voltage drop; LCR; system-on-chip;

fLanguage

English

Journal_Title

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

Publisher

ieee

ISSN

1063-8210

Type

jour

DOI

10.1109/TVLSI.2011.2180742

Filename

6126012