Title :
Flexible electronic assemblies for space applications
Author :
Castillo, Linda Del ; Moussessian, Alina ; McPherson, Ryan ; Zhang, Tan ; Hou, Zhenwei ; Dean, Robert ; Johnson, R. Wayne
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
This work describes the development and evaluation of advanced technologies for the integration of electronic devices within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible (liquid crystal polymer (LCP) and polyimide (PI)) circuits, using gold thermo-compression flip chip bonding, and embedding them within the material. The influence of temperature and flexure on the electrical behavior of active embedded assemblies was evaluated. In addition, the long term thermal cycle resistance of the passive daisy chain assemblies was determined within the Mil Std (-55 to +125°C), extreme low #1 (-125 to +85°C), and extreme low #2 (-125 to +125°C) temperature ranges. The results of these evaluations will be discussed, along with the application of this technology for future NASA missions.
Keywords :
assembling; bending; flexible electronics; flip-chip devices; integrated circuit bonding; liquid crystal polymers; space vehicle electronics; active embedded assemblies; electrical behavior; electronic devices; flexible circuits; flexible electronic assemblies; flexure; liquid crystal polymer; long term thermal cycle resistance; membrane polymer; passive daisy chain assemblies; polyimide; space applications; temperature -125 degC to 125 degC; thermo-compression flip chip bonding; thinned silicon die; Assembly; Biomembranes; Flexible electronics; Flexible printed circuits; Joining processes; Liquid crystal polymers; Polyimides; Silicon; Space technology; Thermal resistance;
Conference_Titel :
Aerospace Conference, 2010 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
978-1-4244-3887-7
Electronic_ISBN :
1095-323X
DOI :
10.1109/AERO.2010.5446717
