• DocumentCode
    2060616
  • Title

    Optimal scheduling of transient cycles for single-armed cluster tools

  • Author

    Dae-Kyu Kim ; Tae-Eog Lee ; Hyun-Jung Kim

  • Author_Institution
    Dept. of Ind. & Syst. Eng., KAIST (Korea Adv. Inst. of Sci. & Technol.), Daejeon, South Korea
  • fYear
    2013
  • fDate
    17-20 Aug. 2013
  • Firstpage
    874
  • Lastpage
    879
  • Abstract
    Cluster tools, widely used for wafer fabrication processes, have complex scheduling problems because a tool consists of several single-wafer processing chambers and a robot, and has a number of scheduling constraints. Most scheduling studies on cluster tools have focused on steady cyclic cycles where identical work cycles are repeated. However, as the lot size tends to be smaller, a tool has longer noncyclic operation cycles such as the start-up and the close-down. Therefore, we examine a way of scheduling for noncyclic cycles of single-armed cluster tools so as to minimize the makespan. To do this, we first analyse fundamental properties of tool behaviours including noncyclic transient cycles. Using the properties, we identify the workload of processing a lot with a number of wafers. Then, we develop the condition for which the conventional backward sequence, which is known to be optimal for cyclic work cycles, has the optimal makespan. Finally, we develop a linear programming model to find the minimum makespan of the backward sequence.
  • Keywords
    cluster tools; linear programming; scheduling; semiconductor technology; transients; backward sequence; linear programming model; noncyclic transient cycles; optimal makespan; optimal scheduling; single-armed cluster tools; wafer fabrication; Job shop scheduling; Loading; Optimal scheduling; Robots; Schedules; System recovery; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering (CASE), 2013 IEEE International Conference on
  • Conference_Location
    Madison, WI
  • ISSN
    2161-8070
  • Type

    conf

  • DOI
    10.1109/CoASE.2013.6653939
  • Filename
    6653939