Title :
A new encapsulating method for semiconductor devices using resin sheets
Author :
Ota, Hideo ; Fujieda, Shinetsu ; Okuyama, Tetsuo
Author_Institution :
Mater. & Devices Res. Lab., Toshiba Corp., Kawasaki, Japan
Abstract :
This paper describes a new encapsulating method using resin sheets. There are three important points to develop this method. 1. New molding process and encapsulating molds. 2. Resin suitable for this method. 3. Measuring method for resin state. This method is suitable for fabricating thin packages. These thin model packages showed the high reliability of pressure cooker test and thermal cycle test
Keywords :
encapsulation; plastic packaging; semiconductor device packaging; encapsulation; molding process; package; pressure cooker test; reliability; resin sheet; semiconductor device; thermal cycle test; Assembly; Bonding; Electronic packaging thermal management; Pressing; Resins; Semiconductor device packaging; Semiconductor devices; Semiconductor materials; Testing; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606145
