• DocumentCode
    2060681
  • Title

    A new encapsulating method for semiconductor devices using resin sheets

  • Author

    Ota, Hideo ; Fujieda, Shinetsu ; Okuyama, Tetsuo

  • Author_Institution
    Mater. & Devices Res. Lab., Toshiba Corp., Kawasaki, Japan
  • fYear
    1997
  • fDate
    18-21 May 1997
  • Firstpage
    54
  • Lastpage
    59
  • Abstract
    This paper describes a new encapsulating method using resin sheets. There are three important points to develop this method. 1. New molding process and encapsulating molds. 2. Resin suitable for this method. 3. Measuring method for resin state. This method is suitable for fabricating thin packages. These thin model packages showed the high reliability of pressure cooker test and thermal cycle test
  • Keywords
    encapsulation; plastic packaging; semiconductor device packaging; encapsulation; molding process; package; pressure cooker test; reliability; resin sheet; semiconductor device; thermal cycle test; Assembly; Bonding; Electronic packaging thermal management; Pressing; Resins; Semiconductor device packaging; Semiconductor devices; Semiconductor materials; Testing; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1997. Proceedings., 47th
  • Conference_Location
    San Jose, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3857-X
  • Type

    conf

  • DOI
    10.1109/ECTC.1997.606145
  • Filename
    606145
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2060681