DocumentCode :
2061905
Title :
6.4 Single-shot 200Mfps 5×3-aperture compressive CMOS imager
Author :
Mochizuki, Futa ; Kagawa, Keiichiro ; Okihara, Shin-ichiro ; Min-Woong Seo ; Bo Zhang ; Takasawa, Taishi ; Yasutomi, Keita ; Kawahito, Shoji
Author_Institution :
Shizuoka Univ., Hamamatsu, Japan
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
Ultra-high-speed cameras are a powerful tool for biology as well as physics and mechanics to analyze the process of ultra-high-speed phenomena. The frame rate of the state-of-the-art burst-readout ultra-high-speed silicon imagers has reached approximately 20Mfps [1,2]. To observe faster phenomena such as plasma generation in laser processing, the state of electrons in a chemical reaction, and so on, much faster cameras are desired. There are several factors that prevent the speed-up of the ultra-high-speed imager: high gate control voltages and high power dissipation for high-efficiency multi-stage charge transfer in CCD imagers, and the current density limit of the power and ground lines and RC-constant of the vertical readout lines in CMOS imagers. Computational imaging can be a promising option to break the design limit of solid-state ultra-high-speed imagers. Several dedicated CMOS imagers have been demonstrated [3,4]. This paper presents a demonstration of a single-chip ultra-high-speed multi-aperture CMOS imager based on compressive sampling. The imager performs single-shot burst-readout image acquisition at a frame rate of 200Mfps.
Keywords :
CMOS image sensors; charge exchange; compressed sensing; current density; elemental semiconductors; readout electronics; silicon; CCD imager; RC constant; aperture compressive CMOS imager; burst readout ultra high speed silicon imager; compressive sampling; current density limit; frame rate; ground lines; high gate control voltage; high power dissipation; multistage charge transfer; power lines; readout lines; single chip ultra high speed multiaperture CMOS imager; single shot burst readout image acquisition; solid-state ultra high speed imager; ultra high speed camera; Apertures; CMOS integrated circuits; Image coding; Laser beams; Measurement by laser beam; Plasmas; Synchronization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7062953
Filename :
7062953
Link To Document :
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