• DocumentCode
    2062252
  • Title

    Research on the Profile Matching of New or Worn Wheel/Rail

  • Author

    Xiaoping, Jia ; Wei, Zhao ; Jun, Zhang ; Chunyan, Wang

  • Author_Institution
    Province Key Lab. of Vehicle Eng. Adv. Technol., Dalian Jiaotong Univ., Dalian, China
  • Volume
    3
  • fYear
    2010
  • fDate
    14-15 Aug. 2010
  • Firstpage
    291
  • Lastpage
    294
  • Abstract
    General profiles chosen from worn wheel profiles and railheads (briefly, worn wheel and rail profile) measured by wheel-rail profile admeasuring apparatus were used to build the finite element models, and the new/worn wheel-rail contact problems were analyzed respectively on the tangent and curved track. Variable regulations of contact area´s size, shape and position were generalized. The results show that, on the tangent and curved track, contact area´s acreage is small and the peak point of equivalent stress is large occur in the model of new wheel-old rail, which indicates that turning worn wheel profile into original profile is unreasonable. Compared with other models, the contact model of old wheel-old rail shows the largest contact area´s size, and such wheel-rail matching is the best one, which provides references for designing the turned wheel profile to adapt to worn railhead profile and reducing the wear of wheel and railhead profile.
  • Keywords
    finite element analysis; mechanical contact; rails; railway engineering; stress analysis; wear; wheels; contact area position; contact area shape; contact area size; curved track; finite element model; profile matching; stress; tangent track; turned wheel profile; wear; wheel-rail contact; wheel-rail matching; wheel-rail profile admeasuring apparatus; worn railhead profile; worn wheel profile; Finite element methods; Flanges; Force; Rails; Shape; Stress; Wheels; FEM; Profile matching; Wear; Wheel-rail contact;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Engineering (ICIE), 2010 WASE International Conference on
  • Conference_Location
    Beidaihe, Hebei
  • Print_ISBN
    978-1-4244-7506-3
  • Electronic_ISBN
    978-1-4244-7507-0
  • Type

    conf

  • DOI
    10.1109/ICIE.2010.246
  • Filename
    5571552