Molding challenges of LOC packages with large devices

Author

Paquet, Marie-Claude

Author_Institution

IBM Canada Ltd., Bromont, Que., Canada

fYear

1997

fDate

18-21 May 1997

Firstpage

95

Lastpage

100

Abstract

This paper presents the manufacturing challenges that were met for plastic encapsulation of lead on chip (LOG) products with large device-to-package area ratios. A new methodology for optimizing product and process performance has been used to eliminate the injection problems which were encountered with these packages. The influence of pellet preheat time and clamping force on the voids and on the knit-lines has been clearly demonstrated in a screening study. The injection speeds have been optimized to completely eliminate the emergence of the defects in a subsequent focusing study

Keywords

encapsulation; integrated circuit manufacture; integrated circuit packaging; plastic packaging; LOC packages; clamping force; injection problems elimination; injection speed optimization; knit-lines; large devices; lead on chip products; manufacturing; moulding process optimisation; pellet preheat time; plastic encapsulation; screening study; voids; Assembly; Bonding; Encapsulation; Lab-on-a-chip; Optimization methods; Plastic packaging; Qualifications; Robustness; Testing; Transfer molding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606152

Filename

606152