Title :
An overview of CMOS VLSI failure analysis and the importance of test and diagnostics
Author :
Vallett, David P.
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Abstract :
This paper reviews the logic failure analysis process and the critical need for design-for-diagnostics. The use of flip-chip packaging will render hardware-based diagnostic techniques from the front side of the die obsolete, e.g., liquid crystal, electron beam testing, and photon emission microscopy. Two primary solutions are discussed: software-based diagnostic methods, e.g., scan, and the adaptation of hardware techniques to the backside of the die
Keywords :
CMOS logic circuits; VLSI; automatic testing; failure analysis; fault diagnosis; flip-chip devices; integrated circuit testing; logic testing; CMOS VLSI; design-for-diagnostics; diagnostics; failure analysis; flip-chip packaging; logic failure analysis; scan; software-based diagnostic methods; CMOS logic circuits; Electron beams; Electron microscopy; Failure analysis; Liquid crystals; Logic design; Packaging; Photonic crystals; Testing; Very large scale integration;
Conference_Titel :
Test Conference, 1996. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-3541-4
DOI :
10.1109/TEST.1996.557160
