An overview of CMOS VLSI failure analysis and the importance of test and diagnostics

This paper reviews the logic failure analysis process and the critical need for design-for-diagnostics. The use of flip-chip packaging will render hardware-based diagnostic techniques from the front side of the die obsolete, e.g., liquid crystal, electron beam testing, and photon emission microscopy. Two primary solutions are discussed: software-based diagnostic methods, e.g., scan, and the adaptation of hardware techniques to the backside of the die