• DocumentCode
    2063406
  • Title

    Observer based junction temperature estimator in thermoelectrical aging

  • Author

    Ginart, Antonio ; Ali, Irfan N. ; Barlas, Irtaza ; Kalgren, Patrick W. ; Roemer, Michael J. ; Goebel, Kai

  • Author_Institution
    Impact Technol., Rochester, NY, USA
  • fYear
    2010
  • fDate
    6-13 March 2010
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Transistor thermal model is nonlinear and highly dependent upon temperature. For reliability assessments, accurate estimation of the junction temperature is especially critical. This paper proposes a novel approach that employs an observer during thermoelectrical aging for estimation of the junction temperature based on available and measurable temperature data.
  • Keywords
    ageing; observers; semiconductor device reliability; thermoelectricity; transistors; observer based junction temperature estimator; reliability assessment; thermoelectrical aging; transistor thermal model; Accelerated aging; Circuit testing; Degradation; Equations; Radio frequency; Semiconductor materials; Temperature dependence; Temperature measurement; Thermal variables measurement; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2010 IEEE
  • Conference_Location
    Big Sky, MT
  • ISSN
    1095-323X
  • Print_ISBN
    978-1-4244-3887-7
  • Electronic_ISBN
    1095-323X
  • Type

    conf

  • DOI
    10.1109/AERO.2010.5446831
  • Filename
    5446831
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2063406