DocumentCode :
2063837
Title :
A thermal-aware mapping algorithm for 3D Mesh Network-on-Chip architecture
Author :
Gui Feng ; Fen Ge ; Shuang Yu ; Ning Wu
Author_Institution :
Coll. of Electron. & Inf. Eng., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
fYear :
2013
fDate :
28-31 Oct. 2013
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, we present a thermal-aware mapping algorithm based on genetic algorithm that automatically maps IP cores onto 3D Mesh Network-on-Chip (NoC) architecture, which mainly takes the temperature deviation into account. In order to verify the efficiency of the algorithm, we applied our algorithm on various multimedia benchmark applications, and evaluated the performance and temperature with Nirgam and HotSpot. The result shows that, the deviation of temperature between nodes is reduced by 35% on average in our algorithm compared with random mapping, and the peak temperature is reduced by 13% on average, such that the elimination of hotspots and equilibrium of temperature are achieved with better performance.
Keywords :
circuit optimisation; genetic algorithms; network-on-chip; thermal engineering; three-dimensional integrated circuits; 3D mesh network-on-chip architecture; HotSpot; IP cores; Nirgam; NoC; genetic algorithm; random mapping; temperature deviation; thermal-aware mapping algorithm; Algorithm design and analysis; Benchmark testing; Biological cells; Genetic algorithms; IP networks; Power demand; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
ISSN :
2162-7541
Print_ISBN :
978-1-4673-6415-7
Type :
conf
DOI :
10.1109/ASICON.2013.6811834
Filename :
6811834
Link To Document :
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