Title :
MCVP-NoC: Many-Core Virtual Platform with Networks-on-Chip support
Author :
Dexue Zhang ; Xiaoyang Zeng ; Zongyan Wang ; Weike Wang ; Xinhua Chen
Author_Institution :
State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China
Abstract :
Many-core SoC (MCSoC) design is one of chip design trends and challenges. Modeling and simulation for large scale MCSoC design is the key to get it right the first time. NoC is the most important component of future MCSoC. A novel modeling tool, MCVP-NoC (Many-Core Virtual Platform with Networks-on-Chip support) was designed for large scale MCSoC modeling, and can be used in design space exploration, early software development and system verification. MCVP-NoC was built on SystemC, OVP(Open Virtual Platform) and TLM2.0, integrated with Orion2.0 for power and area estimation. MCVP-NoC can run real software code, and can be used to evaluate the performance of the MCSoC design under real application load.
Keywords :
integrated circuit design; integrated circuit modelling; multiprocessing systems; network-on-chip; MCVP-NoC; OVP; Orion2.0; SystemC; TLM2.0; area estimation; design space exploration; large scale MCSoC design; many-core SoC design; many-core virtual platform with networks-on-chip support; open virtual platform; power estimation; software code; software development; system verification; Analytical models; Computer architecture; Decoding; Estimation; Nickel; Software; System-on-chip;
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-6415-7
DOI :
10.1109/ASICON.2013.6811836
