• DocumentCode
    2064154
  • Title

    A highly pipelined VLSI architecture for all modes and block sizes intra prediction in HEVC encoder

  • Author

    Cong Liu ; Weiwei Shen ; Tianlong Ma ; Yibo Fan ; Xiaoyang Zeng

  • Author_Institution
    State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The adoption of 35 prediction modes and quad-tree structure in intra coding of High Efficiency Video Coding (HEVC) significantly improves the coding efficiency. In this paper, a highly pipelined 16-pixel parallel VLSI architecture of intra prediction in HEVC encoder is proposed, supporting all prediction modes and all block sizes. Original pixels are used to help to decide prediction mode and block partition in the premise of negligible PSNR degradation, and a universal predictor is presented. In order to reduce internal buffers when scanning full-mode and full-size predictions in encoder, post-order traversal is applied to the quad-tree structure blocks. It takes 8967 cycles to complete the intra prediction of a whole 32×32 treeblock, including prediction and the decision of mode and block partition. This design is synthesized with TSMC 65nm CMOS technology. It can run at 600 MHz, supporting real-time encoding of 1080P@30fps video sequence.
  • Keywords
    CMOS integrated circuits; VLSI; parallel architectures; quadtrees; video coding; HEVC encoder; PSNR degradation; TSMC CMOS technology; block partition; block size intraprediction mode; frequency 600 MHz; full-size predictions; high efficiency video coding; highly pipelined 16-pixel parallel VLSI architecture; internal buffer reduction; post-order traversal; quad-tree structure blocks; scanning full-mode; size 65 nm; universal predictor; video sequence; Computer architecture; Engines; Hardware; Standards; Throughput; Very large scale integration; Video coding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811849
  • Filename
    6811849