Title :
Analysis inductively coupling wireless connection in 3D package
Author :
BaoCun Wang ; Yu Guoyi ; Xiaofei Chen ; Li Zhang ; Zou, X.
Author_Institution :
Sch. of Opt. & Electron. Inf., Zhuazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
A accuracy physical model and Greenhouse algorithm is presented in this paper in 3D package. A relative simple and fast method of calculation the coupling inductors coefficient is presented in this paper. The parameters of the inductors coupling is high efficiency are discussed. The appropriate position is calculated where the interference of inductor channel is minimum in the 3D package.
Keywords :
coupled circuits; inductors; integrated circuit interconnections; integrated circuit packaging; three-dimensional integrated circuits; 3D package; Greenhouse algorithm; coupling inductor coefficient; inductively coupling wireless connection; inductor channel; Arrays; Couplings; Inductance; Inductors; Interference; Three-dimensional displays; Wireless communication; 3D package; High speed interconnect; inductive coupling;
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-6415-7
DOI :
10.1109/ASICON.2013.6811861
