Title :
A new fiber-communication miniature sensor module
Author :
Sheen, Chin-Shown ; Chi, Sien
Author_Institution :
Inst. of Electro-Opt. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
Sensing using a multi-chip package for the optical sensing device enjoys the benefits of both optics and integrated circuits. By including the advent of MEMS technologies it can potentially lead to a new generation of miniaturized optical sensing devices and systems. We propose and fabricate a miniaturized radiation-sensing module, which transfers the output analog signal to a light signal, which can be easily delivered through a single mode fiber. It consists of an infrared sensing thermopile, an ASIC chip and a LED, which acts as an electro-optical signal transfer component. Details of component design, fabrication, and experimental results are presented
Keywords :
CMOS analogue integrated circuits; analogue processing circuits; application specific integrated circuits; fibre optic sensors; infrared detectors; integrated optoelectronics; microsensors; multichip modules; radiometry; thermopiles; 1.2 mum; ASIC chip; LED; MEMS technologies; electro-optical signal transfer component; fiber-communication miniature sensor module; fiber-optic radiometry; infrared sensing thermopile; light signal; miniaturized optical sensing devices; multi-chip package; optical sensing device; output analog signal; radiation-sensing module; single mode fiber; Application specific integrated circuits; Integrated circuit packaging; Integrated circuit technology; Integrated optics; Micromechanical devices; Optical devices; Optical fiber devices; Optical fiber sensors; Optical sensors; Photonic integrated circuits;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2000. IMTC 2000. Proceedings of the 17th IEEE
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-5890-2
DOI :
10.1109/IMTC.2000.846884
