Title :
3D hybrid modeling of substrate coupling noise in lightly doped mixed-signal ICs
Author :
Yongsheng Wang ; Fang Li ; Hualing Yang ; Yonglai Zhang ; Yanhui Ren
Author_Institution :
Micro-Electron. Dept., Harbin Inst. of Technol., Harbin, China
Abstract :
Because of the widely used of mixed-signal SoC, substrate coupling noise has become an important problem. A reasonable substrate model is necessary for estimating the impact of substrate noise. Compared with previous work, the proposed 3D hybrid model includes 3D RC substrate network for the aggressor and victim and macro model for the noise coupling path. Developed model of commonly used for isolating noise such as guard ring is also proposed. The efficiency of different regions of guard ring and single and double guard ring are compared and analyzed to draw a general conclusion.
Keywords :
integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; three-dimensional integrated circuits; 3D RC substrate network; 3D hybrid modeling; double guard ring; lightly doped mixed-signal ICs; macromodel; mixed-signal SoC; noise coupling path; single guard ring; substrate coupling noise; Computational modeling; Couplings; Integrated circuit modeling; Noise; Solid modeling; Substrates; Three-dimensional displays; 3D hybrid model; 3D substrate model; Guard ring isolation; Micro model; substrate coupling noise;
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-6415-7
DOI :
10.1109/ASICON.2013.6811905
